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11 results on '"Choong-Un Kim"'

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1. Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects.

3. Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size.

4. CMOS-compatible fabrication of room-temperature single-electron devices.

5. Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell.

6. Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects.

7. Study of pore structure and stability in porous low-k interconnects using electrolyte voltammetry.

8. Mechanism of reliability failure in Cu interconnects with ultralow-κ materials.

10. Thin Film Materials for Solar Cell and Biosensor Applications.

11. Foreword.

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