11 results on '"Choong-Un Kim"'
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2. Rate dependence of bending fatigue failure characteristics of lead-free solder joint.
3. Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size.
4. CMOS-compatible fabrication of room-temperature single-electron devices.
5. Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell.
6. Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects.
7. Study of pore structure and stability in porous low-k interconnects using electrolyte voltammetry.
8. Mechanism of reliability failure in Cu interconnects with ultralow-κ materials.
9. Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit.
10. Thin Film Materials for Solar Cell and Biosensor Applications.
11. Foreword.
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