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Purpose - Tombstoning and voiding have been plaguing the surface mount assembly industry for decades. The recent global move toward lead-free soldering and the extensive adoption of microvia technology further aggravate the problems. The present study investigates the impact of SnAgCu (SAC) alloy composition on these important issues. Design/methodology/approach - In this study, tombstoning and voiding at microvias are studied for a series of SAC lead-free solders, with an attempt to identify a possible "composition window" for controlling these problems. Properties which may be related to these problems, such as alloy surface tension, alloy melting pattern, and solder wetting behaviour, were investigated in order to assess the critical characteristics required to control these problems. Findings - The results indicate that the tombstoning of SAC alloys is greatly influenced by the solder composition. Both the wetting force and the wetting time at a temperature well above the melting point have no correlation with the tombstoning frequencies. Because the tombstoning is caused by imbalanced wetting forces, the results suggest that the tombstoning may be controlled by the wetting at the onset of the paste melting stage. A maximum tombstoning incidence was observed for the 95.5Sn3.5Ag1Cu alloy. The tombstoning rate decreased with increasing deviation in Ag content from this composition. A differential scanning calorimetry (DSC) study indicated that this was mainly due to the increasing presence of the pasty phase in the solders, which result in a slower wetting speed at the onset of solder paste melting stage. Surface tension plays a minor role, with lower surface tension correlating with a higher tombstoning rate. The voiding rate at the microvias was studied by employing simulated microvias. The voiding level was lowest for the 95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu alloys, and increases with a further decrease in the Ag content. The results indicate that voiding at microvias is governed by the via filling and the exclusion of fluxes. The voiding rate decreased with decreasing surface tension and increasing wetting force, which in turn is dictated by the solder wetting or spreading. Both low surface tension and high solder wetting prevents the flux from being entrapped within a microvia. A fast wetting speed may also facilitate reducing voiding. However, this factor is considered not as important as the final solder coverage area. Research limitations/implications - In general, compositions which deviate from the ternary eutectic SAC in Ag content, particularly with a Ag content lower than 3.5Ag, exhibit a greater solid fraction at the onset of melting, resulting in a lower tombstoning rate, presumably due to a slower wetting speed. The SAC compositions with an Ag content lower than 3.5 per cent, such as 2.5Ag, resulted in a lower tombstoning rate with minimal risk of forming Ag3Sn intermetallic platelets. On the other hand, ternary eutectic SAC exhibits a lower surface tension resulting in an easier solder spread or solder wetting, and consequently exhibit a higher tombstoning frequency and a lower incidence of voiding. Practical implications - Provides a solution to the tombstoning problem in lead-free soldering. Originality/value - The present study provided a solution to the tombstoning problem encountered in lead free soldering by controlling the SAC solder alloy compositions. [ABSTRACT FROM AUTHOR]

We have studied the CP violation discovery reach in a neutrino oscillation experiment with superbeam, neutrino factory and monoenergetic neutrino beam from the electron capture process. For NSI satisfying model-dependent bound for shorter baselines (like CERN-Fréjus set-up) there is insignificant effect of NSI on the the discovery reach of CP violation due to δ. Particularly, for the superbeam and neutrino factory we have also considered relatively longer baselines for which there could be significant NSI effects on CP violation discovery reach for higher allowed values of NSI. For the monoenergetic beam only shorter baselines are considered to study CP violation with different nuclei as neutrino sources. Interestingly for non-standard interactions— and of neutrinos with matter during propagation in longer baselines in the superbeam, there is the possibility of better discovery reach of CP violation than that with only Standard Model interactions of neutrinos with matter. For complex NSI we have shown the CP violation discovery reach in the plane of Dirac phase δ and NSI phase . The CP violation due to some values of δ remain unobservable with present and near future experimental facilities in the superbeam and neutrino factory. However, in the presence of some ranges of off-diagonal NSI phase values there are some possibilities of discovering total CP violation for any value even at confidence level for neutrino factory. Our analysis indicates that for some values of NSI phases total CP violation may not be at all observable for any values of δ. Combination of shorter and longer baselines could indicate in some cases the presence of NSI. However, in general for NSIs the CP violation discovery reach is better in neutrino factory set-ups. Using a neutrino beam from the electron capture process for nuclei Sn and 152Yb, we have shown the discovery reach of CP violation in a neutrino oscillation experiment. Particularly for Sn nuclei CP violation could be found for about 51% of the possible δ values for a baseline of 130 km with boost factor . Although the nuclei 152Yb is technically more feasible for the production of a mono-energetic beam, it is found to be unsuitable in obtaining good discovery reach of CP violation. [ABSTRACT FROM AUTHOR]