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WTe2, a low-symmetry transition metal dichalcogenide, has broad prospects in functional device applications due to its excellent physical properties. When WTe2 flake is integrated into practical device structures, its anisotropic thermal transport could be affected greatly by the substrate, which matters a lot to the energy efficiency and functional performance of the device. To investigate the effect of SiO2/Si substrate, we carried out a comparative Raman thermometry study on a 50 nm-thick supported WTe2 flake (with κzigzag = 62.17 W·m−1·K−1 and κarmchair = 32.93 W·m−1·K−1), and a suspended WTe2 flake of similar thickness (with κzigzag = 4.45 W·m−1·K−1, κarmchair = 4.10 W·m−1·K−1). The results show that the thermal anisotropy ratio of supported WTe2 flake (κzigzag/κarmchair ≈ 1.89) is about 1.7 times that of suspended WTe2 flake (κzigzag/κarmchair ≈ 1.09). Based on the low symmetry nature of the WTe2 structure, it is speculated that the factors contributing to thermal conductivity (mechanical properties and anisotropic low-frequency phonons) may have affected the thermal conductivity of WTe2 flake in an uneven manner when supported on a substrate. Our findings could contribute to the 2D anisotropy physics and thermal transport study of functional devices based on WTe2 and other low-symmetry materials, which helps solve the heat dissipation problem and optimize thermal/thermoelectric performance for practical electronic devices. [ABSTRACT FROM AUTHOR]

Thermal interface materials (TIMs) with high through-plane thermal conductivity are urgently desired to avoid overheating of high-power density electronics. Introducing and aligning fillers in polymer matrixes via magnetic field is a promising method to improve the thermal conductivity of the polymer. However, either the fillers need to be modified with magnetic particles or a strong magnetic field is needed for good alignment in high filler content. This prevents further improvement of the through-plane thermal conductivity. Herein, mesophase pitch-based carbon fibers (MPCFs) with a content as high as 76 wt.% are aligned vertically in water-soluble polyvinyl alcohol (PVA) under a low magnetic field (∼ 0.4 T), forming a vertically aligned MPCF (VAMPCF)/PVA composite with an extraordinary through-plane thermal conductivity of 86 W/(m·K), which is higher than that of many alloys. In addition, both theoretical and experimental results demonstrate that the critical intensity of the magnetic field needed for good alignment of the fillers depends on their size and magnetic susceptibility. Furthermore, the water solubility of PVA makes it easy to recycle MPCFs. This study offers an inspired venue to develop excellent and eco-friendly TIMs to meet ever increasing demand in heat dissipation for electronics. [ABSTRACT FROM AUTHOR]