1. A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices.
- Author
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Tu, Yuqian, Liu, Bin, Yao, Guanghong, Luo, Hongjie, Jia, Xiao, Du, Jun, and Xu, Cui
- Abstract
In high-power electronic devices, the rapid accumulation of heat presents significant thermal management challenges that necessitate the development of advanced thermal interface materials (TIMs) to ensure the performance and reliability of electronic devices. TIMs are employed to facilitate an effective and stable heat dissipation pathway between heat-generating components and heat sinks. In recent years, anisotropic one-dimensional and two-dimensional materials, including carbon fibers, graphene, and boron nitride, have been introduced as fillers in polymer-based TIMs due to their high thermal conductivity in specific directions. The orientation of the fillers in the polymer matrix has become an important issue in the development of a new generation of high-performance TIMs. To provide a systematic understanding of this field, this paper mainly discusses recent advances in advanced oriented TIMs with high thermal conductivity (>10 W/(m·K)). For each filler, its preparation strategies and enhancement mechanisms are analyzed separately, with a focus on the construction of oriented structures. Notably, there are few reviews related to carbon fiber TIMs, and this paper details recent research results in this field. Finally, the challenges, prospects, and future development directions of advanced TIMs are summarized in the hope of stimulating future research efforts. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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