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A new one-dimensional device simulation package developed for the simulation of neutron radiatiol! effects in silicon avalanche photodiodes is described. The software uses a finite difference technique to solve the time-independent semiconductor equations across a user specified structure. Impact ionisation and illumination are included, allowing accurate simulation with minimal assumptions about the device under investigation. The effect of neutron radiation damage is incorporated via the introduction of deep acceptor levels subject to Shockley-Read-Hall statistics. Two models are presented. A reverse reach through model, based on the EG&G C30626E reverse reach through avalanche photo diode originally proposed for use in the CMS electromagnetic calorimeter, and a reach through model, based on widely available commerical devices. A short experimental study on two commercial silicon avalanche photodiodes, a C30719F reverse reach through APD and a C30916E reach through APD, is presented for comparison with the simulation data. To allow full comparison with the simulated predictions, the commercial devices were irradiated at the Rutherford Appleton Laboratory's ISIS facility. The simulated data shows good qualitative agreement with the measurements performed on the commercial devices, quantitative predictions would require exact information about the doping profile. The characteristic behaviour of the devices is predicted over a wide range of conditions both before and after neutron irradiation. The effect of ionised deep acceptors in the bulk of the devices is investigated. The simulation package provides a useful tool for the analysis of semiconductor devices, particularly in areas where a non-ionising radiation damage is prevelent e.g. high energy physics, and provides a good basis for further development.

This Thesis consists of four chapters. The first is primarily for background information on the effects of radiation on MOS devices and the theory of wafer bonding; the second gives a full discussion of all practical work carried out for manufacture of Field Effect Test Capacitors, the third discusses manufacture of vacuum Field Effect Transistors (FET's) and the fourth discusses the testing of these devices. Using a thermally bonded field effect capacitor structure, a vacuum dielectric was studied for use in high radiation environments with a view to manufacturing a CMOS compatible, micro machined transistor. Results are given in the form of high frequency C-V curves before and after a 120 kGy(Si), 12 MRad(Si), dose from a Co⁶⁰ source showing a 1 Volt shift. The work is then extended to the design and manufacture of a micro machined, under-etch technique, Field Effect Transistor for use in high radiation areas. Results are shown for Threshold, Subthreshold and Transfer characteristics before and after irradiation up to a total dose of 100kGy or 10MRad. The conclusion from this work is that it should be possible to commercially manufacture practical vacuum dielectric field effect transistors which are radiation hard to at least 120 kGy(Si).

Radiation-induced changes in microstructures often lead to significant changes in mechanical properties of alloys used in the construction of nuclear reactors. It is desirable to test small specimens to make efficient use of the small volumes available in test and commercial reactor cores and also because small specimens are less affected by the sometimes steep flux gradients experienced in reactor cores and the sometimes large temperature gradients developed in the specimens from gamma heating. (Continues...).