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The voids at the interface of anisotropic conductive film (ACF) to glass are typically formed during bonding process for Chip-On-Glass (COG) packages. The low temperature (∼23 °C) Ar一H2 plasma pretreatment on glasses are investigated to enhance the void-free bonding of ACF to glass for COG packages. The void fraction of glass with ACF is significantly reduced from 52% of untreated-glass to 0% of Ar一H2 plasma-pretreated glass. The improved void-free ACF bonding is found to be highly dependent on the surface characteristics of glass. The surface energies, surface morphologies and surface compositions of glasses are discussed how to affect the enhanced void-free bonding of ACF to glass by low temperature Ar一H2 plasmas. The surface energies, such as total surface energies, polar surface energies and dispersive surface energies of glasses are obtained by calculating the basis of the measured contact angles of three various surface tensions of liquids. The surface morphologies of glasses are observed by field emitted scanning electron microscopy (FESEM). The surface compositions, such as atomic compositions and chemical bond compositions of glasses are analyzed using X-ray photoelectron spectroscopy (XPS). [ABSTRACT FROM AUTHOR]

This study focuses on the effects of particle composition, particle shape, particle size and oxidizing temperature on the electrical properties of copper-filled electrically-conductive adhesives (CFECAs) and the pressure-dependent conduction behavior of compressed copper particles (CCPs). Silver-coated copper particles and un-coated copper particles of both spherical and flake-shaped types were oxidized at 30°C, 175°C and 240°C for two hours. The copper particles were dispersed in an epoxy matrix for CFECAs or compressed in a mold for CCPs. Silver-coated copper particles showed significantly greater oxidation resistance than un-coated copper particles since the silver coating provides good oxidation resistance at temperatures lower than 175°C. Thermogravimetric Analysis (TGA), X-ray diffraction (XRD) and Auger Electron Spectroscopy were used to observe how metal oxides such as AgO and Cu2O affected the electrical properties of CFECAs and the conduction behavior of CCPs. The electrically-conductive adhesives (ECAs) filled with flake-shaped copper particles offer better electrical conduction than the ECAs filled with spherical copper particles. [ABSTRACT FROM AUTHOR]

In gasohol, the concentration of aqueous ethanol should be further increased from 95.6 % (by mass) to 99.5 % (by mass) by dehydration. In industrial processes, zeolite 3A is usually applied for alcohol−water separation. However, it adsorbs ethanol and water at a similar level (uptake of water/uptake of ethanol = 2.01), resulting in inefficient separation. In this study, potato starch was chosen as an adsorption material because of its very high selectivity and greater capacity for water (uptake of water/uptake of ethanol = 64.18). Conversely, the adsorption capacity of potato starch after regeneration will be substantially reduced, requiring further modification of the material. After regeneration, the unmodified starch decreased its adsorption capacity by 19.70 %, while the immobilized starch had a slight decrease of only 0.56 %. The sol−gel process was used to immobilize the starch, and the equilibrium adsorption isotherm was obtained to describe the immobilized sorbent. The selectivity of the immobilized starch sorbent had a ratio of 4.39 (water to ethanol). Compared to the zeolite 3A in the industrial dehydration process, this selectivity of immobilized starch is almost double that of zeolite 3A. The Langmuir model best describes the experimental isotherm curve of the selected sorbents. [ABSTRACT FROM AUTHOR]

The objectives of this research are to develop, for water-blown open cell rigid polyurethane foam, a theoretical model based on Maxwell's equation (taking into account conduction in the solid and gas phases), and to establish Rosseland's diffusion equation (taking into account radiation across the cell-gas spaces, but excluding convection) to perdict the thermal conductivity of the polyurethane foam. The physical properties performances of the open cell rigid PU foam were experimentally investigated. The mean deviations of thermal conductivities data between the theoretical calculations of this model, compared with experiment data obtained from the ASTM C518 method, are within 3% to 8% within the mean temperatures from 4°C to 32°C, respectively. [ABSTRACT FROM AUTHOR]