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Particle-matrix interfaces can play an important role in heat propagation through particulate composites. We investigated the possibility of using frequency domain thermoreflectance combined with a numerical thermal model to measure in situ the thermal resistance of the particle-matrix interface in particulate composite materials. We found that the sensitivity of the technique depended on the matrix thermal conductivity, the particle size, and the value of the interface thermal resistance. In general, high thermal conductivity matrix materials and small particles will present higher sensitivity to the interface thermal resistance. We tested the technique with diamond particles embedded in tin and showed that the interface thermal resistance could be measured for these samples. [ABSTRACT FROM AUTHOR]

High-power semiconductor applications require a thermal interface die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current thermal interface material solutions such as thermal grease, thermal pads, and silicones have been industry standards, however may fall short in performance for high-temperature or high-power applications. This article focuses on development of a cutting-edge die attach solution for thermal interface management, focusing on fusion-type epoxy-based Ag adhesive with an extremely low storage modulus and the thermal conductivity reaching up to 30 W/mK, and also very low-modulus, low-temperature pressureless sintering silver die attach with a thermal conductivity of 70 W/mK. [ABSTRACT FROM AUTHOR]

The thermal properties of micron scale particles are an important factor in the design of composite materials and other applications. Here we present an optical technique based on frequency domain thermoreflectance (FDTR) that is capable of measuring the thermal conductivity of individual particles a few microns across. In addition, the technique can provide values for a particle’s effective volume which is a new capability compared to conventional FDTR applied to multilayer samples. We also show and explain the response of systems that constrain heat flow along the in-plane direction due to a boundary. We tested this technique with natural diamond and doped silicon particles of different sizes. For the diamond particles, the thermal conductivity values obtained were within the range of reported literature values, while for the silicon particles, the thermal conductivities were slightly lower than the bulk sample they were fabricated from, possibly due to defects introduced during the fabrication process. [ABSTRACT FROM AUTHOR]