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This article presents the implementation of the intrachip propagation channel in the case of a wireless interconnect network-on-chip used for parallel computing applications. These wireless interconnects still require precise propagation models to demonstrate that they can be considered as a realistic efficient alternative to the wired interconnects. First, we show the advantages of wireless solutions for broadcast applications. As this type of circuit will be realized using silicon as the main component, we present in the literature review the problems and constraints of integrated antennas and channels on silicon. Then, a deep electromagnetic study for the intrachip transmission is conducted, with measurements done using two manufactured prototypes of printed dipole antennas on silicon in the Ka-band (26–40 GHz) and in the $V$ -band (40–75 GHz) with different scenarios. The good agreement between simulations and measurements validates the problems encountered due to the silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intrachip transmission on integrated circuits and to prove the feasibility of the wireless network on chip using integrated antennas. [ABSTRACT FROM AUTHOR]

This paper addresses the topic of high-speed interconnects in high density systems [systems on chip (SoCs), systems in package (SiPs), systems on package (SoPs), and multichip modules (MCMs)]. These microstrip or coplanar lines have, often, an underlayer of orthogonal metal grids liable to affect transmission characteristics. The characterization proposed in this paper relies on S-parameter measurements and electromagnetic simulations. The grids under study are of two kinds: grounded (CC) and floating (CO). In both cases, the signal is distorted in the time domain further to the occurrence of transmission zeroes whose position depend mainly on the grid length and, of course, on the grid charge, i.e., CC or CO. In order to easily estimate this position, we developed a simple equivalent circuit model and validated it by measurements and electromagnetic simulations. Then it was used to develop a set of expressions enabling one to analytically pinpoint the location of transmission zeroes in the frequency domain, while remaining valid for any underlayer of orthogonal metal lines or grids. [ABSTRACT FROM AUTHOR]