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Photonic Integrated Circuits (PICs) benefit from the technology advances in the semiconductor industry to incorporate an ever-increasing number of photonic components on a single chip to create large-scale photonic integrated circuits. We here present a broadband, compact and low-loss Silicon Photonic MEMS switch based on a Single-Pole Double-Throw (SPDT) architecture, where curved electrostatic actuators mechanically displace a movable input waveguide to redirect the optical signal on chip efficiently to either of two output waveguides. The photonic switch has been fabricated in an established silicon photonics technology platform with custom MEMS release post-processing. With a compact footprint of 65 × 62 μm2, the switch exhibits an extinction ratio exceeding 23 dB over 70 nm optical bandwidth, a low insertion loss and a fast response time below 1 μs, meeting the requirements for integration in large-scale reconfigurable Photonic Integrated Circuits. [2020-0391] [ABSTRACT FROM AUTHOR]

Photonic integrated circuits have seen a dramatic increase in complexity over the past decades. This development has been spurred by recent applications in datacenter communications and enabled by the availability of standardized mature technology platforms. Mechanical movement of wave-guiding structures at the micro- and nanoscale provides unique opportunities to further enhance functionality and to reduce power consumption in photonic integrated circuits. We here demonstrate integration of MEMS-enabled components in a simplified silicon photonics process based on IMEC’s Standard iSiPP50G Silicon Photonics Platform and a custom release process. [ABSTRACT FROM AUTHOR]

Metal nanowires can emit coherent polarized thermal radiation, work as uncooled bolometers, and provide localized heating. In this paper, we engineer the temperature dynamics of electrically driven Pt nanoheaters on a silicon-on-insulator substrate. We present three designs and we electrically characterize and model their thermal impedance in the frequency range from 3Hz to 3MHz. Finally, we show a temperature modulation of 300K while consuming less than 5 mW of power, up to a frequency of 1.3 MHz. This result can lead to significant advancements in thermography and absorption spectroscopy. [ABSTRACT FROM AUTHOR]

Through the presentation of analytical data from bioassay experiments, measured by polarimetry, we demonstrate for the first time a real time immunoassay within a free standing macroporous alumina membrane. The 200 nm nominal pore diameter of the membrane enables flow-through, thereby providing an ideal fluidic platform for the targeted delivery of analytes to bioreceptors immobilized on the pore walls, enabling fast sensing response times and the use of small sample volumes (<100 µL). For the immunoassay, the pore walls were first coated with the functional copolymer, copoly(DMA-NAS) using a novel coupling process, before immobilization of the allergen protein, β-lactoglobulin, by spotting. The immuno-assay then proceeded with the binding of the primary and secondary antibody cognates, rabbit anti-β-lactoglobulin and anti-rabbit IgG respectively. Through the use of streptavidin coated quantum dots as refractive index signal enhancers, a noise floor for individual measurements of 3.7 ng/mL (25 pM) was obtained, with an overall statistical, or formal assay LOD of 33.7 ng/mL (225 pM), for total assay time below 1 h. [ABSTRACT FROM AUTHOR]

We present two transfer bonding schemes for incorporating fragile nanoporous inorganic membranes into microdevices. Such membranes are finding increasing use in microfluidics, due to their precisely controllable nanostructure. Both schemes rely on a novel dual-cure dry adhesive bonding method, enabled by a new polymer formulation: OSTE(+), which can form bonds at room temperature. OSTE(+) is a novel dual-cure ternary monomer system containing epoxy. After the first cure, the OSTE(+) is soft and suitable for bonding, while during the second cure it stiffens and obtains a Young's modulus of 1.2 GPa. The ability of the epoxy to react with almost any dry surface provides a very versatile fabrication method. We demonstrate the transfer bonding of porous silicon and porous alumina membranes to polymeric microfluidic chips molded into OSTE(+), and of porous alumina membranes to microstructured silicon wafers, by using the OSTE(+) as a thin bonding layer. We discuss the OSTE(+) dual-cure mechanism, describe the device fabrication and evaluate the bond strength and membrane flow properties after bonding. The membranes bonded to OSTE(+) chips delaminate at 520 kPa, and the membranes bonded to silicon delaminate at 750 kPa, well above typical maximum pressures applied to microfluidic circuits. Furthermore, no change in the membrane flow resistance was observed after bonding [ABSTRACT FROM AUTHOR]