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Intelligent engineering of graphene-based electronic devices on SiC(0001) requires a better understanding of processes used to deposit gate-dielectric materials on graphene. Recently, Al2O3 dielectrics have been shown to form conformal, pinhole-free thin films by functionalizing the top surface of the graphene with fluorine prior to atomic layer deposition (ALD) of the Al2O3 using a trimethylaluminum (TMA) precursor. In this work, the functionalization and ALD-precursor adsorption processes have been studied with angle-resolved photoelectron spectroscopy, low energy electron diffraction, and X-ray photoelectron spectroscopy. It has been found that the functionalization process has a negligible effect on the electronic structure of the graphene, and that it results in a twofold increase in the adsorption of the ALD-precursor. In situ TMA-dosing and XPS studies were also performed on three different Si(100) substrates that were terminated with H, OH, or dangling Si-bonds. This dosing experiment revealed that OH is required for TMA adsorption. Based on those data along with supportive in situ measurements that showed F-functionalization increases the amount of oxygen (in the form of adsorbed H2O) on the surface of the graphene, a model for TMA-adsorption on graphene is proposed that is based on a reaction of a TMA molecule with OH. [ABSTRACT FROM AUTHOR]

The ultra-wide bandgap semiconductor gallium oxide (Ga2O3) offers substantial promise to significantly advance power electronic devices as a result of its high breakdown electric field and maturing substrate technology. A key remaining challenge is the ability to grow electronic-grade epitaxial layers at rates consistent with 20–40 μm thick drift regions needed for 20 kV and above technologies. This work reports on extensive characterization of epitaxial layers grown in a novel metalorganic chemical vapor deposition tool that permits growth rates of 1.0–4.0 μm h−1. Specifically, optical, structural and electrical properties of epilayers grown at ∼1 μm h−1 are reported, including employment in an operating MOSFET. The films demonstrate relatively smooth surfaces with a high degree of structural order, limited point defectivity (Nd − Na ≈ 5 × 1015 cm−3) and an optical bandgap of 4.50 eV. Further, when employed in a MOSFET test structure with an n+ doped channel, a record high mobility for a transistor structure with a doped channel of 170 cm2 V−1 s−1 was measured via the Hall technique at room temperature. This work reports for the first time a β-Ga2O3 MOSFET grown using Agnitron Technology's high growth rate MOCVD homoepitaxial process. These results clearly establish a significant improvement in epilayer quality at growth rates that can support future high voltage power device technologies. [ABSTRACT FROM AUTHOR]

The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N2 overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E2 and A1 (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations. [ABSTRACT FROM AUTHOR]

The propagation behavior of basal plane dislocations from off-oriented 4H-SiC substrates into homoepitaxial layers has been investigated using transmission electron microscopy (TEM), secondary electron microscopy (SEM), and chemical etching. Cross-sectional TEM shows that basal plane dislocations in the substrate are dissociated into pairs of partial dislocations separated by a stacking fault with a width of about 40 nm. Near the substrate/epilayer interface, where most of the basal plane dislocations convert to threading edge dislocations, the two partials constrict before converting. Threading edge segments are inclined by about 20° from the c-axis toward the down-step direction. It is concluded that the critical and limiting step of the dislocation conversion process is constriction of the dissociated partials. Growth surface morphology at the emergence point of the basal plane dislocation was imaged using SEM and is thought to play an important role in the constriction. [ABSTRACT FROM AUTHOR]

The remarkable electronic properties of graphene strongly depend on the thickness and geometry of graphene stacks. This wide range of electronic tunability is of fundamental interest and has many applications in newly proposed devices. Using the mid-infrared, magneto-optical Kerr effect, we detect and identify over 18 interband cyclotron resonances (CR) that are associated with ABA and ABC stacked multilayers as well as monolayers that coexist in graphene that is epitaxially grown on 4H-SiC. Moreover, the magnetic field and photon energy dependence of these features enable us to explore the band structure, electron-hole band asymmetries, and mechanisms that activate a CR response in the Kerr effect for various multilayers that coexist in a single sample. Surprisingly, we find that the magnitude of monolayer Kerr effect CRs is not temperature dependent. This unexpected result reveals new questions about the underlying physics that makes such an effect possible. [ABSTRACT FROM AUTHOR]

Soliton-like pulses with a 1984-nm center wavelength are produced from a Tm-doped mode-locked fiber laser. The linear cavity has a graphene saturable absorber mirror at one end and a fiber Bragg grating as the output coupler. The laser operates without dispersion compensation, and the repetition rate was tuned from 20 to 5 MHz by the addition of SMF-28 fiber. The dry transfer process used to place the graphene on a mirror could be extended to any optical substrate. This enables integration of graphene with optics such as an optical window coated with a graphene filter or a graphene-saturable absorber placed directly on a semiconductor laser facet. [ABSTRACT FROM AUTHOR]

An approach to fabricate a set of simultaneously operating dual-UV-wavelength detectors is described. The fabrication flow relies on the confined-epitaxy growth method. The confined epitaxial Alα Ga1--α N-layer stacking approach is used to establish simultaneous multiple UV-wavelength detection. The chosen stoichiometries of specific epitaxial layers set the wavelength sensitivity at approximately 355 nm for pixel A and 320 nm for pixel B. Spectral responsivity plots of the detectors clearly show the dual-UV-color sensitivity of the pair. The detectors have signal-to-noise ratios of 15 and 17 and spectral responsivity values of 0.12 A/W and 0.05 A/W for pixel A and pixel B, respectively. [ABSTRACT FROM AUTHOR]

This paper reports pH-selective potentiometric responses of epitaxial nitrogen-polar (0001) GaN films on sapphire substrates. The potential of a nitrogen-polar GaN substrate increased with decreasing solution pH from 10 to 2 in a Nernstian manner, whereas it did not significantly change upon increasing the concentrations of the cationic and anionic interfering species. In particular, the negligible responses to anions marked a sharp contrast with previously reported results on gallium-polar GaN that exhibited Nernstian responses to anions. The potentiometric response to pH probably originates from the adsorption of H+ onto oxide-coated nitrogen-polar GaN substrates having polarization-induced negative surface charge. [ABSTRACT FROM AUTHOR]