1. Chip-On-Glass Bonding Using Sn Bump and Non-Conductive Adhesive for LCD Application.
- Author
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Bae-Yong Kim, Zhigang Chen, and Young-Ho Kim
- Subjects
- *
ADHESIVES , *ELECTRODES , *ALUMINUM , *LIQUID crystal displays , *FLAT panel displays , *SEMICONDUCTORS - Abstract
We developed a new chip-on-glass (COG) bonding method using non-conductive adhesive (NCA) and Sn bumps. The bonding was performed with various electrode pads on the glass substrate at 150°C for 150 s under 100 MPa. The initial average contact resistance was 5.7 mΩ for Au pad, 19.6 mΩ for indium-tin oxide (ITO)/Au pad, 11.2 mΩ for Al pad respectively. Thermal cycling test was performed in the temperature range between 0°C and 100°C. The contact resistance of the Sn bump-Au pad joints did not change even after 1000 cycles. In contrast, the joints formed on other type of pads failed electrically between 300 and 500 cycles. [ABSTRACT FROM AUTHOR]
- Published
- 2006
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