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In this work, the Metal-rich phase Chromium Aluminum (CrAl)/Ceramic phase Chromium Aluminum Nitride (CrAlN) multi-layer coatings were prepared by Arc Ion Plating (AIP). The micro-structure and phase composition of CrAl/CrAlN multi-layer coatings were characterized, and the microstructure, mechanical properties, residual stress and fracture toughness of the coating were emphatically analyzed. It has been found out that the residual stress of the multi-layer coating was only −0.932 ± 0.065 GPa, which was significantly lower than that of the mono-layer coating for −1.569 ± 0.093 GPa. At the same time, it was also found that the preferred growth orientation of the coating changed from a mono-layer (111) to a multi-layer (200) crystal plane. The hardness of the multi-layer (22.74 ± 0.57 GPa) is slightly lower than that of the mono-layer (24.92 ± 0.5 GPa), and the adhesion strength (46.2 ± 3.8 N) is obviously higher than that of the mono-layer (37.4 ± 2.4 N), and the fracture toughness is also higher (8.7 ± 0.8 MPa m1/2). In addition, the mechanism of crack initiation and propagation in stress-induced coatings was studied in detail on the basis of the structure of micro-nano CrAl/CrAlN multi-layer coatings. [ABSTRACT FROM AUTHOR]

Diamond-Cu composites have been considered to be the next generation of electronic packing materials. One of the key stumbles for such an application is the joining problem between diamond-Cu composites and other materials due to the poor wettability of the diamond particles in the composites. In order to overcome this hurdle, pure Cu powder was thermally sprayed onto diamond-Cu substrate by low-temperature high-velocity oxygen fuel spraying process. Microstructure and some fundamental properties of the coating obtained were systematically investigated, and morphologies of the single splat deposited on the diamond-Cu substrate were also observed. The splats obtained have good adhesion with the substrate as fine particles flattened sufficiently, while the coarse particles were significantly deformed. The coating was quite dense with porosity lower than 1%, oxygen content under 0.5% and thermal conductivity about 266 Wm K and still remained on the diamond-Cu substrate after 50 thermal shock cycles between 300 °C and water bath at room temperature. Meanwhile, the solderability of the coating was significantly improved. Therefore, Cu coating deposited on diamond-Cu substrate by low-temperature high-velocity oxygen fuel spraying process can be beneficial in electronic industry assisting with soldering and improved wettability for joining of other materials. [ABSTRACT FROM AUTHOR]