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Abstract: A comparative study was carried out on the deposition mechanism, microstructure, and corrosion resistance of Cu films electrodeposited from the base electrolyte of CuCl2·2H2O in a choline chloride–ethylene glycol eutectic solvent with absence and presence of the additive of ethylene diamine (EDA). The base electrolyte is unstable and produces rough Cu films with columnar grains. Upon the introduction of EDA, the modified electrolyte becomes stable and the nucleation of Cu deposits is strongly inhibited, thus producing a smooth and compact surface with finer grains. Uniform corrosion and decreased corrosion current density are recognized in the fine grained Cu films. [Copyright &y& Elsevier]

Abstract: Titanium incorporated amorphous carbon nitride films were deposited by direct current magnetron sputtering. The films change from amorphous to nanocomposite structure, the relative fraction of sp 3 C–N bonding decreases significantly from 2.17 to 1.64 with the increase of Ti content from 2.7at.% to 12.3 at.%. For the films with high Ti content, the nanocrystalline TiN embedded in a-CN x matrix, while principally TiN did not appear to be well formed for the film containing low Ti content. Potentiodynamic polarization, in vitro human osteoblasts and murine fibroblast cell adhesion tests were employed to assess the corrosion performances of Ti6Al4V alloy coated with the films in Tyrode''s solution, and the biocompatibility of Ti-incorporated a-CN x films, respectively. Titanium incorporation increases the corrosion resistance of a-CN x films, and the higher corrosion potential and lower corrosion current density are observed for the alloy coated with the film containing lower Ti content. The high osteoblast adhesion and activation demonstrate the enhanced biocompatibility of Ti alloy coated with Ti-incorporated a-CN x films. The improved biocompatibility in biological environment is attributed to structural change after titanium introduction. [Copyright &y& Elsevier]