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• Fabricated porous structure in p-type Cu 0.07 Bi 0.5 Sb 1.5 Te 3 compounds by assisting PVA as pore former and studied TE properties. • Lattice thermal conductivity effectively decreased by ~ 38% due to intensified phonon scattering at microscale pores. • The maximum ZT of 1.342 at 400 K and η max of ~ 9.4% at ∆T = 200 K was obtained for the sample with porosity of 10.58%. • The hardness and compressive strength of porous bulks show significantly higher than commercial zone melting materials. [Display omitted] In the background of enhancing thermoelectric (TE) figure of merit of solid-state materials, the introduction of porous structure can significantly decrease lattice thermal conductivity by intensifying phonon scattering at the inhomogeneous microscale pores. Herein, we developed a porous structure in Cu 0.07 Bi 0.5 Sb 1.5 Te 3 compounds by utilizing PVA as the pore former, and systematically studied its effect on thermoelectric properties. The results revealed that the reduction in thermal conductivity (~28%) was greater than the decrease in electrical conductivity (~17%) with increasing porosity, indicating long-wavelength phonon scattering was enhanced at micro-scale pores. Consequently, a peak zT of 1.342 at 400 K, and a zT avg of 1.254 in the temperature range of 300–500 K and an η max of ~9.4% at ΔT = 200 K were achieved in the porous sample (10.58%), which all are higher than that of dense sample. The hardness and compressive strength of the porous samples were significantly higher than commercial zone melting ingots. The proposed methodology is a cost-effective and efficient way of producing high-performance TE devices with good mechanical stability for real life practical applications. [ABSTRACT FROM AUTHOR]

Decoupling the Seebeck coefficient, electrical and thermal conductivity has been a great challenge in efforts to obtain thermoelectric materials with a high figure of merit (ZT) for power generation and cooling applications. In this work, p-type Bi 0.5 Sb 1.5 Te 3 samples were fabricated by combining gas atomization and spark plasma sintering. Heat-treatment and subsequent consolidation during SPS stimulated the recrystallization of grains and reduced texture, contributing to reduced carrier scattering. This enhanced carrier mobility by 29%. The recrystallization also induces a hierarchy of fine and coarse crystal grains with random orientations. This mixed microstructure contributed to the simultaneous enhancement of the Seebeck coefficient and electrical conductivity, while reducing lattice thermal conductivity, due to effective phonon scattering by the fine grains and Sb 2 O 3 nanoparticles. The significant improvement in power factor and relatively low κ L resulted in a peak ZT of 1.1 at 350 K for the 470 °C treated sample. This was about 47% higher than the initial sample (ZT = 0.75 at 350 K). The average ZT for all the heat treated samples reached over unity in the range of 300–500 K. This work suggests that the spark plasma heat treatment and consolidation processes enable the recrystallization, allowing the thermoelectric properties to be decoupled, enhancing ZT. Image 1 • The hierarchical structures were formed in Bi 0.5 Sb 1.5 Te 3 alloys via recrystallization. • Decoupled the electrical and thermal properties by forming the hierarchical structures. • Heat-treatment and subsequent consolidation during SPS stimulated the recrystallization of grains and reduced texture. • ZT enhanced by 47% for recrystallized samples than the initial samples. [ABSTRACT FROM AUTHOR]