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Today, electronic device cooling is a significant challenge that has been addressed by utilizing heat sinks with various designs. The numerical and experimental investigation of changes in the wavy channel heat sink height is carried out to improve the performance. As a novelty, the heat sink's height remains constant to assess how open space above the channels affects the performance. The work aims to assess the impact of various heat fluxes and flow rates on temperature, Nu number, flow, and velocity; meanwhile conducting a non-dimensional analysis. At the flowrate of 6.94 cm 3 / s , once the channel's height was reduced to 10 mm, the highest temperature decreased by 7.84%, while by the decrement of height to 7 and 4 mm, it witnessed 14.14% and 23.81% rises, respectively. The local Nusselt number for 10 mm height and 19.56 cm 3 / s flow ranges between 127.47 and 106.53 in 5.17 W/cm2 heat flux. The flow with higher dimensionless velocity is dispersed throughout the open area above the heat sink, once the 12.7 mm height is reduced to 10 mm. The performance evaluation criterion of the system is determined by considering the ratio between Nu number and friction factor, which is obtained between 1.08 and 1.22 for 10 mm channel height. Thus, the 10 mm wavy channel height can be suggested for cooling electrical equipment. • Investigating channel height variations in constant-height heat sinks to determine open space impact above the wavy channel. • The wavy channel heat sink with 10 mm height shows higher performance due to flow mixing. • An analysis of velocity and temperature is provided using non-dimensional methods. • The performance evaluation criterion is compared for different channel heights while keeping the heat sink height constant. [ABSTRACT FROM AUTHOR]

In this study, microchannel heat sinks with symmetric and parallel wavy microchannels are studied in a wide range of Reynolds numbers from 50 to 700 via a three-dimensional fluid-solid conjugate model. The results show that the symmetric configuration yields higher Nusselt numbers than the parallel one, and it is especially true at higher Reynolds numbers and larger amplitude-to-wavelength ratios. The heat transfer enhancement can be attributed to the fact that the symmetric configuration induces four Dean vortices in the cross sections perpendicular to the flow path, whereas there are only two Dean vortices in the parallel configuration, leading to stronger coolant mixing and hence the higher Nusselt numbers in the symmetric configuration. However, because of the presence of channel throats, the symmetric configuration also achieves a significantly high pressure penalty. As a result, the overall performance of the symmetric configuration is slightly lower than that of the parallel configuration. To enhance the performance of wavy microchannel heat sinks, modified symmetric and parallel wavy configurations are proposed, in which several transverse gaps are added into ribs to connect adjacent microchannels. The results demonstrate that such a secondary branch design significantly enhances Nusselt numbers for both the parallel wavy configurations owing to the enhanced fluid mixing between adjacent microchannels. Moreover, it is found that, as compared with its original wavy configurations, secondary branches slightly increase the pressure drop across the modified parallel configuration. Thus, the overall performances are markedly enhanced for the modified parallel configurations. As expected, secondary branches greatly reduce the pressure drop across the modified symmetric configuration. Beyond expectation, the suction effect of channel throats due to secondary branches can weaken the Dean vortices in the valley vs valley regions and worsen the heat transfer performance, especially for the heat sink with larger Re and amplitude-to-wavelength ratios. As a result, the modified symmetric wavy configurations are suggested to employ with a wider gap and small amplitude-to-wavelength ratio. Generally speaking, the modified parallel wavy configuration is more dominant than the symmetric one. • Symmetric and parallel wavy microchannel heat sinks are studied numerically. • Parallel configuration shows higher Nu but larger pressure drop penalty. • Modified wavy configurations are proposed with secondary branch design. • Modified parallel configurations yield better overall performance. • Modified symmetric configuration achieves better overall performance partly. [ABSTRACT FROM AUTHOR]

The cooling capability of heat sinks is important for a central processing unit (CPU). In this work, simulation has been done to study heat transfer (HT) in a heat sink (HS) mounted on the triangular cylinder chip of a CPU is studied, to explore the thermofluid behaviour of the designed micro-pin-fin heat sink. Air cooling methods are used for heat extraction. This numerical work considers the effects of inlet turbulence intensity (TI) and fin diameter (D) of the micro-pin-fin on the performance of the heat sink. Turbulent SST model is applied to capture turbulence regime in the system. The heat transfer and pressure coefficient were obtained at different Reynolds number (Re) (i.e. different inlet velocities). As shown in this study, the Nusselt number (Nu) increases with increase in air flow velocity which enhance the heat extraction from CPU. [ABSTRACT FROM AUTHOR]