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[Display omitted] Self-supporting tree skeleton and densely stackable phenolic resin are cleverly coupled together by a "rebar-concrete" structure. The thick electrode as a master of space utilization has extremely high areal and volumetric energy density. This work confirms the effective coupling of the self-supporting skeleton and powder materials, providing novel ideas for the preparation of thick electrodes with high mass loading. • A "rebar-concrete" structure is proposed to facilitate the high space utilization of thick electrodes. • The areal capacitance of the thick electrode reaches an astonishing 11F cm−2. • The assembled SSC device delivers competitive areal energy density of 0.63 mWh cm−2. The thick electrode design with high packing density of active materials can increase the capacity in a limited space. However, the key challenge is still to develop a system with high space utilization and ensure electron/ion transport in thick electrode. This work proposes an interesting "rebar-concrete" structure, which successfully prepared wood/phenolic resin-derived thick electrode with high space utilization by in-situ polymerization of phenolic resin (concrete) in the wood (rebar) channel. The electrode exhibits an excellent three-dimensional interconnected hierarchical pore structure due to the uniform activation of in-situ anchored KOH particles. The mass loading (35 mg cm−2) and areal capacitance (11F cm−2) of the obtained composite electrode are increased to 446 % and 1257 % of the original balsa wood, respectively. The assembled symmetric supercapacitor (SSC) exhibits a high energy density of 0.63 mWh cm−2 (3.91 mWh cm−3) and an excellent cycle stability (95 % retention after 50 000 cycles), showing good practicability in lighting LEDs or driving a fan. This strategy achieves effective coupling of self-supporting skeleton and powder materials, providing more insights and possibilities for the preparation of high energy density thick electrodes. [ABSTRACT FROM AUTHOR]

The development of robust and bioinspired adhesives with excellent performances including fast gel time, low cost, good adhesion strength and stability, and excellent solvent and temperature resistance against harsh environment is urgent for practical applications. In this paper, kinds of natural polyphenolic adhesives have been successfully fabricated via the multiple polyphenol-diisocyanate cross-linking (PDC) reactions between natural polyphenols (extracts) and diisocyanate molecules. Under heating, as-prepared adhesives could effectively adhere onto a wide range of substrates (i.e. PTFE, PET, PMMA, Al, Cu, paper, glass, wood) through hierarchical interactions. Moreover, these adhesives exhibited great adhesion stability against complex solvents and low-temperature environments, whose adhesion strength could remain unchanged after soaking solvents after 30 days, which was conducive to their potential applications in industry and chemical fields, including petroleum, wood, metal, glass, plastics, and rubber adhesion. We believed that this work would provide new strategies towards the preparation of robust adhesives with excellent resistant against various solvents and low temperature for many fields by using naturally occurring building blocks. Natural polyphenolic adhesives were successfully fabricated via the multiple polyphenol-diisocyanate cross-linking (PDC) reactions between natural polyphenols (extracts) and diisocyanate molecules. Under heating, as-prepared adhesives could effectively adhere to a wide range of substrates (i.e. PTFE, PET, PMMA, Al, Cu, paper, glass, wood) through hierarchical interactions. Moreover, these adhesives exhibited great adhesion stability against complex solvents and low-temperature environments, and the adhesion strength could even remain unchanged after soaking solvents after 30 days. [Display omitted] • Natural polyphenolic adhesives were successfully fabricated. • As-prepared adhesives could effectively adhere to various substrates. • These adhesives exhibited great solvents and low-temperature resistance. [ABSTRACT FROM AUTHOR]