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In this work, the epitaxial semipolar (11–22) AlN was prepared on nonpolar m-sapphire substrate by combining sputtering and high-temperature annealing. According to our systematic measurements and analysis from XRD, Raman spectra, and AFM, the evolution of crystalline structure and morphology was investigated upon increasing AlN thickness and annealing duration. The annealing operation intensively resets the lattice and improves the crystalline quality. By varying the film thickness, the contribution from the AlN-sapphire interface on crystalline quality and lattice parameters during the annealing process was investigated, and its contribution was found to be not so obvious when the thickness increased from 300 nm to 1000 nm. When the annealing was performed under durations from 1 to 5 h, the crystalline quality was found unchanged; meanwhile, the evolution of morphology was pronounced, and it means the crystalline reorganization happens prior to morphology reset. Finally, the annealing treatment enabled a zig-zag morphology on the AlN template along the sapphire [0001] direction in the plane, which potentially affects the subsequent device epitaxy process. Therefore, our results act as important experience for the semipolar nitride semiconductor laser device preparation, particularly for the epitaxy of microcavity structure through providing the crystalline evolution. [ABSTRACT FROM AUTHOR]

4H-polytype AlN has been grown on a 4H-SiC substrate with the (1120) face via plasma-assisted molecular-beam epitaxy. The microscopic structure of the AlN/4H-SiC interface was examined using high-resolution transmission electron microscopy, and the polytype replication of the 4H structure from the 4H-SiC(1120) substrate was evidently confirmed. The x-ray rocking curve of (1120) diffraction for the single crystalline 4H-AlN epilayer exhibited a very small linewidth of 90 arc sec, suggesting noticeably small tilting around the [1120] direction. The excellent crystalline quality is probably owing to the polytype matching between the 4H-AlN epilayer and the 4H-SiC substrate, which resulted in remarkable reduction of defects at the interface. © 2003 American Institute of Physics. [ABSTRACT FROM AUTHOR]