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Diamond-Cu composites have been considered to be the next generation of electronic packing materials. One of the key stumbles for such an application is the joining problem between diamond-Cu composites and other materials due to the poor wettability of the diamond particles in the composites. In order to overcome this hurdle, pure Cu powder was thermally sprayed onto diamond-Cu substrate by low-temperature high-velocity oxygen fuel spraying process. Microstructure and some fundamental properties of the coating obtained were systematically investigated, and morphologies of the single splat deposited on the diamond-Cu substrate were also observed. The splats obtained have good adhesion with the substrate as fine particles flattened sufficiently, while the coarse particles were significantly deformed. The coating was quite dense with porosity lower than 1%, oxygen content under 0.5% and thermal conductivity about 266 Wm K and still remained on the diamond-Cu substrate after 50 thermal shock cycles between 300 °C and water bath at room temperature. Meanwhile, the solderability of the coating was significantly improved. Therefore, Cu coating deposited on diamond-Cu substrate by low-temperature high-velocity oxygen fuel spraying process can be beneficial in electronic industry assisting with soldering and improved wettability for joining of other materials. [ABSTRACT FROM AUTHOR]

Hot compression features of Ti-55511 alloy are investigated by high-temperature compression tests in α+β region. It is found that the flow stress and softening mechanisms are obviously influenced by deformation conditions. The true stress decreases with the reduced strain rate or the raised temperature. The spheroidization of α phase and dynamic recrystallization (DRX) of β phase easily occur at low temperatures such as 973, 1003 and 1033 K, while the dynamic recovery (DRV) of β phase mainly occurs at high temperatures such as 1063 K because of the transformation from α phase to β phase at relatively high temperatures A dislocation density-based constitutive model, which is associated with DRV, work hardening mechanisms and the spheroidization of α phases, is established and validated to describe flow behavior. The correlation coefficient (R) and average absolute relative error (AARE) of the established model are 0.9924 and 6.8%, respectively. 3D power dissipation efficiency maps and processing maps are established to determine the appropriate processing window, i.e., too low temperatures (lower than 973 K) or too high strain rates (higher than 1 s−1) easily induce flow instability. Therefore, the medium temperature (1003–1063 K) and the low strain rate (0.001–0.1 s−1) are applicable for thermal compression of the studied titanium alloy. • Hot compression features of Ti-55511 alloy is investigated by high-temperature compression tests in α+β region. • DRX easily occurs at low temperatures, while DRV mainly occurs at high temperatures. • A accurate dislocation density-based constitutive model considering the spheroidization of α phases is established. • The optimal forming temperature and strain rate are 1003–1063 K and 0.001–0.1 s−1. [ABSTRACT FROM AUTHOR]