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The development of robust and bioinspired adhesives with excellent performances including fast gel time, low cost, good adhesion strength and stability, and excellent solvent and temperature resistance against harsh environment is urgent for practical applications. In this paper, kinds of natural polyphenolic adhesives have been successfully fabricated via the multiple polyphenol-diisocyanate cross-linking (PDC) reactions between natural polyphenols (extracts) and diisocyanate molecules. Under heating, as-prepared adhesives could effectively adhere onto a wide range of substrates (i.e. PTFE, PET, PMMA, Al, Cu, paper, glass, wood) through hierarchical interactions. Moreover, these adhesives exhibited great adhesion stability against complex solvents and low-temperature environments, whose adhesion strength could remain unchanged after soaking solvents after 30 days, which was conducive to their potential applications in industry and chemical fields, including petroleum, wood, metal, glass, plastics, and rubber adhesion. We believed that this work would provide new strategies towards the preparation of robust adhesives with excellent resistant against various solvents and low temperature for many fields by using naturally occurring building blocks. Natural polyphenolic adhesives were successfully fabricated via the multiple polyphenol-diisocyanate cross-linking (PDC) reactions between natural polyphenols (extracts) and diisocyanate molecules. Under heating, as-prepared adhesives could effectively adhere to a wide range of substrates (i.e. PTFE, PET, PMMA, Al, Cu, paper, glass, wood) through hierarchical interactions. Moreover, these adhesives exhibited great adhesion stability against complex solvents and low-temperature environments, and the adhesion strength could even remain unchanged after soaking solvents after 30 days. [Display omitted] • Natural polyphenolic adhesives were successfully fabricated. • As-prepared adhesives could effectively adhere to various substrates. • These adhesives exhibited great solvents and low-temperature resistance. [ABSTRACT FROM AUTHOR]