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Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

Navigating through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies, many not found in other texts, on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, laser impingement, nanometer scale surface modification, and more. Surface Modification and Mechanisms: Friction, Stress, and Reaction Engineering offers guidelines for the consideration and design of wear and frictional performance and provides a unique understanding of surface structural changes that occur during various engineering procedures.

Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings. Its chapters explore a wide range of tribolo