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This reference text offers the reader a comprehensive insight into recent research breakthroughs in blockchain, the Internet of Things (IoT), artificial intelligence and material structure and hybrid technologies in their integrated platform, while also emphasizing their sustainability aspects.The text begins by discussing recent advances in energy materials and energy conversion materials using machine learning, as well as recent advances in optoelectronic materials for solar energy applications. It covers important topics including advancements in electrolyte materials for solid oxide fuel cells, advancements in composite materials for Li-ion batteries, progression of materials for supercapacitor applications, and materials progression for thermochemical storage of low-temperature solar thermal energy systems.This book: Discusses advances in blockchain, the Internet of Things, artificial intelligence, material structure and hybrid technologies Covers intelligent techniques in materials progression for sensor development and energy material characterization using signal processing Examines the integration of phase change materials in construction for thermal energy regulation in new buildings Explores the current happenings in technology in conjunction with basic laws and mathematical models Connecting advances in engineering materials with the use of smart techniques including artificial intelligence, machine learning and Internet of Things (IoT) in a single volume, this text will be especially useful for graduate students, academic researchers and professionals in the fields of electrical engineering, electronics engineering, materials science, mechanical engineering and computer science.

Advances in Imaging and Electron Physics merges two long-running serials-Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

The field of optics has been accelerating at an unprecedented rate, due both to the tremendous growth of the field of fiber-optic communications, and to the improvement of optical materials and devices. Throughput capabilities of fiber systems are accelerating faster than Moore's law, the famous growth rate of silicon chip capability, which has propelled that industry relentlessly over decades. In addition, new optical storage techniques push the limits of information density, with an ever decreasing cost per bit of storage. Economic investment in photonics is at an all-time high. At the same time, other fields of optics, adaptive optics for instance, are bringing new capabilities to more classical applications such as astronomical imaging. New lasers continue to be developed, with applications in display, sensing, and biomedicine following at ever-shorter intervals after the initial discoveries. Given this background, the NATO Mediterranean Dialog Advanced Research Workshop on Unconventional Optical Elements for Information Storage, Processing and Communications, held in Israel on October 19-21, 1998, came at an opportune moment in the history of optics. Its aim was to overview the current state-of-the-art and encourage cooperation in the Mediterranean region, with a view to highlighting and enhancing the existing potential for further development and innovation. The workshop included participants from Belgium, France, Germany, Greece, Israel, Italy, Jordan, Morocco, Portugal, Romania, Russia, Switzerland, Turkey, United Kingdom and USA.

Internationally recognized experts in the field of holographic interferometric testing, X-ray testing, and structural analysis by finite element techniques have come together in ESPRIT project 898 to develop a system that integrates these techniques. This system acts as an external interface between the complementary nondestructive testing methods and computer based structural analysis. In the book the testing and analysis techniques are presented and compared with special emphasis on problems regarding their combination and integration. The architecture and the components of the interface system are described. Experiments proving the feasibility and applicability of the concepts are presented. The chapters of the book dealing with the different techniques are written by the individual partners of the project. A common test object is investigated by all techniques. The book helps the customer to select the testing and analysis method most suitable for his problem. It also presents the background for building up integrated testing equipment for analysis and control.

Image processing and a major contribution on microscopy dominate the latest volume of these advances. This volume looks at theory and it's application in a practical sense, with a full account of the methods used and realistic detailed application. The authors do this by examining the latest developments, historic illustrations and mathematical fundamentals of the exciting developments in imaging and applying them to realistic practical situations.Addressing and solving daily issues faced by researchers, consultants and engineers working in this field, makes this book essential reading•Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physics•Emphasises theory and it's application in a practical sense•Provides the FIRST full statement of a radical new approach to'phase calibration'and the solution of this important and difficult problem, pioneered by A, Lannes

Advances in Imaging and Electron Physics merges two long-running serials-Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

Discover the Applicability, Benefits, and Potential of New Technologies As advances in algorithms and computer technology have bolstered the digital signal processing capabilities of real-time sonar, radar, and non-invasive medical diagnostics systems, cutting-edge military and defense research has established conceptual similarities in these areas. Now civilian enterprises can use government innovations to facilitate optimal functionality of complex real-time systems. Advanced Signal Processing details a cost-efficient generic processing structure that exploits these commonalities to benefit commercial applications. Learn from a Renowned Defense Scientist, Researcher, and InnovatorThe author preserves the mathematical focus and key information from the first edition that provided invaluable coverage of topics including adaptive systems, advanced beamformers, and volume visualization methods in medicine. Integrating the best features of non-linear and conventional algorithms and explaining their application in PC-based architectures, this text contains new data on: Advances in biometrics, image segmentation, registration, and fusion techniques for 3D/4D ultrasound, CT, and MRI Fully digital 3D/ (4D: 3D+time) ultrasound system technology, computing architecture requirements, and relevant implementation issues State-of-the-art non-invasive medical procedures, non-destructive 3D tomography imaging and biometrics, and monitoring of vital signs Cardiac motion correction in multi-slice X-ray CT imaging Space-time adaptive processing and detection of targets interference-intense backgrounds comprised of clutter and jamming With its detailed explanation of adaptive, synthetic-aperture, and fusion-processing schemes with near-instantaneous convergence in 2-D and 3-D sensors (including planar, circular, cylindrical, and spherical arrays), the quality and illustration of this text's concepts and techniques will make it a favored reference.

Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

The series bridges the gap between academic researchers and R&D designers by addressing and solving daily issues, which makes it essential reading.This volume looks at theory and it's application in a practical sense, with a full account of the methods used and realistic detailed application. The authors do this by examining the latest developments, historic illustrations and mathematical fundamentals of the exciting developments in imaging and electron physics and apply them to realistic practical situations.• Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physics• Presents theory and it's application in a practical sense, providing long awaited solutions and new findings• Provides the steps in finding answers for the highly debated questions

The subjects reviewed in the Advances in Imaging and Electron Physics series cover a broad range of themes including microscopy, electromagnetic fields and image coding. This volume concentrates on microscopy and pattern recognition and also electron physics. Several of these topics are covered in this volume, which opens with a long chapter of monograph stature on quantitative electron microscopy at the atomic resolution level by scientists from a well-known and very distinguished Antwerp University Laboratory. This is unique in that the statistical aspects are explored fully. This is followed by a contribution by A.M. Grigoryan and S.S. Again on transform-based image enhancement, covering both frequency-ordered systems and tensor approaches. The volume concludes with an account of the problems of image registration and ways of solving them by Maria Petrou of the University of Surrey; feature detection, related image transforms and quality measures are examined separately. The text bridges the gap between academic researchers and R&D designers by addressing and solving daily issues, which makes this book essential reading. Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physics Presents theory and it's application in a practical sense, providing long awaited solutions and new findings Provides a comprehensive overview of international congress proceedings and associated publications, as source material

Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

The subjects reviewed in the Advances in Imaging and Electron Physics series cover a broad range of themes including microscopy, electromagnetic fields and image coding. This volume concentrates on microscopy and pattern recognition and also electron physics. The text bridges the gap between academic researchers and R&D designers by addressing and solving daily issues, which makes this book essential reading. Emphasizes broad and in depth article collaborations between world-renowned scientists in the field of image and electron physics Presents theory and it's application in a practical sense, providing long awaited solutions and new findings Provides a comprehensive overview of international congress proceedings and associated publications, as source material

This book presents novel and advanced technologies for medical sciences in order to solidify knowledge in the related fields and define their key stakeholders. The fifteen papers included in this book were written by invited experts of international stature and address important technologies for medical sciences, including: computational modeling and simulation, image processing and analysis, medical imaging, human motion and posture, tissue engineering, design and development medical devices, and mechanic biology.Different applications are treated in such diverse fields as biomechanical studies, prosthesis and orthosis, medical diagnosis, sport, and virtual reality. This book is of interest to researchers, students and manufacturers from a wide range of disciplines related to bioengineering, biomechanics, computational mechanics, computational vision, human motion, mathematics, medical devices, medical image, medicine and physics.

Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical & Electron Microscopy. It features extended articles onthe physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

Academic Press is pleased to announce the creation of Advances in Imaging and Electron Physics. This serial publication results from the merger of two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical & Electron Microscopy. Advances in Imaging & Electron Physics will feature extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies,microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

Academic Press is pleased to announce the creation of Advances in Imaging and Electron Physics. This serial publication results from the merger of two long running serials--Advances in Electronics and Electron Physics and Advances in Optical & Electron Microscopy. Advances in Imaging & Electron Physics will feature extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies,microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains. Continuation order customers for either of the original Advances will receiveVolume 90, the first combined volume.

This book provides state-of-the-art information on ambient assisted living (AAL), and focuses on technologies, services, living spaces, policies, and interventions to promote health, improve quality of life, and active aging. It includes various research contributions, case studies, and projects where assistive technologies are successfully applied in the field, and it covers a wide range of topics: Tailoring products and services to the Aging society, Bio-data and Artificial sensing AAL scenarios, Cognition, and Technologies, and Designing for Inclusion and Well-Being. The volume gathers the refereed proceedings of the 12th Italian Forum on Ambient Assisted Living (ForItAAL), held in Bari, Italy on June 14-16, 2023. With its wide-ranging contributions to the topic, the book will inspire the readers and the researchers to continue their exploration of AAL technologies to support the development of products and services that make a real difference in people's daily lives.

This book presents selected, peer-reviewed proceedings of the 3rd International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022), held in the city of Can Tho, Vietnam, from 10 to 13 November 2022. The purpose of the conference is to explore and ensure an understanding of the critical aspects contributing to sustainable development with a focus on advanced mechanical engineering, automation, materials, machines and methods. The contributions published in this book come from authors representing universities, research institutes and industrial companies and reflect the results of a very broad spectrum of research, from micro- and nanoscale materials design and processing, to mechanical engineering technology in industry. Many of the contributions selected for these proceedings focus on materials modeling, eco-material processes and mechanical manufacturing. Volume 3 of this book focuses on topics dedicated to sustainable approaches in machine design, life cycle engineering, and energy management for manufacturing processes.

This book gathers timely contributions on metrology and measurement and control systems, across different disciplines and fields of applications. The chapters, which were presented at the 8th International Scientific-Technical Conference, MANUFACTURING 2024, held on May 14-16, 2024, in Poznan, Poland, cover cutting-edge research and best-practices concerning the use of AI-based optical, computed tomographic, coordinate metrology and vision inspection systems to assess manufacturing processes and products. They discuss strategies for automating, and for improving the effectiveness of quality control and measuring processes. All in all, this book provides both researchers and practitioners with a timely guide on cutting-edge measuring and control systems supporting the development of modern manufacturing in the context of digitalization, sustainability and industry applications.

The book provides a detailed methodology for addressing the needs of material processing (polymer/ metals/ bio-gels etc.) and various engineering applications in the next 5-10 years. The book presents a detailed mechanical, morphological, thermal, and rheological characterization of selected materials and highilights the required environmental standards to be maintained.

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come.This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book.The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come.This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book.The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

This book presents selected, peer-reviewed proceedings of the 3rd International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022), held in the city of Can Tho, Vietnam, from 10 to 13 November 2022. The purpose of the conference is to explore and ensure an understanding of the critical aspects contributing to sustainable development with a focus on advanced mechanical engineering, automation, materials, machines and methods. The contributions published in this book come from authors representing universities, research institutes and industrial companies and reflect the results of a very broad spectrum of research, from micro- and nanoscale materials design and processing, to mechanical engineering technology in industry. Many of the contributions selected for these proceedings focus on materials modeling, eco-material processes and mechanical manufacturing. Volume 2 of this book focuses on topics dedicated to materials applications, machining, and renewable energy. Selected topics include: material machinability and economic efficiency, sustainable development manufacturing technology, environmental protection, as well as green development and climate change prevention.

The goal of this textbook is to equip readers with as structured knowledge of soft robotics as possible. Seeking to overcome the limitations of conventional robots by making them more flexible, gentle and adaptable, soft robotics has become one of the most active fields over the last decade. Soft robotics is also highly interdisciplinary, bringing together robotics, computer science, material science, biology, etc. After the introduction, the content is divided into three parts: Design of Soft Robots; Soft Materials; and Autonomous Soft Robots. Part I addresses soft mechanisms, biological mechanisms, and soft manipulation & locomotion. In Part II, the basics of polymer, biological materials, flexible & stretchable sensors, and soft actuators are discussed from a materials science standpoint. In turn, Part III focuses on modeling & control of continuum bodies, material intelligence, and information processing using soft body dynamics. In addition, the latest research resultsand cutting-edge research are highlighted throughout the book. Written by a team of researchers from highly diverse fields, the work offers a valuable textbook or technical guide for all students, engineers and researchers who are interested in soft robotics.

This book focuses on the application of soft computing in materials and manufacturing sectors with the objective to offer an intelligent approach to improve the manufacturing process, material selection and characterization techniques for developing advanced new materials. It unveils different models and soft computing techniques applicable in the field of advanced materials and solves the problems to help the industry and scientists to develop sustainable materials for all purposes. The book focuses on the overall well-being of the environment for better sustenance and livelihood. Firstly, the authors discuss the implementation of soft computing in the various areas of engineering materials. They also review the latest intelligent technologies and algorithms related to the state-of-the-art methodologies of monitoring and effective implementation of sustainable engineering practices. Finally the authors examine the future generation of sustainable and intelligent monitoring techniques beneficial for manufacturing, and cover novel soft computing techniques for the purpose of effective manufacturing processes at par with the standards laid down by the International Standards of Organization (ISO). This book is intended for academics and researchers from all the fields of engineering interested in joining interdisciplinary initiatives on soft computing techniques for advanced materials and manufacturing.

This book offers a practical approach to understanding, designing, and building sound software based on solid principles. Using a unique Q&A format, this book addresses the issues that engineers need to understand in order to successfully work with software engineers, develop specifications for quality software, and learn the basics of the most common programming languages, development approaches, and paradigms. The new edition is thoroughly updated to improve the pedagogical flow and emphasize new software engineering processes, practices, and tools that have emerged in every software engineering area.Features: Defines concepts and processes of software and software development, such as agile processes, requirements engineering, and software architecture, design, and construction. Uncovers and answers various misconceptions about the software development process and presents an up-to-date reflection on the state of practice in the industry. Details how non-software engineers can better communicate their needs to software engineers and more effectively participate in design and testing to ultimately lower software development and maintenance costs. Helps answer the question: How can I better leverage embedded software in my design? Adds new chapters and sections on software architecture, software engineering and systems, and software engineering and disruptive technologies, as well as information on cybersecurity. Features new appendices that describe a sample automation system, covering software requirements, architecture, and design. This book is aimed at a wide range of engineers across many disciplines who work with software.

This handbook comprehensively covers the rapidly evolving field of power generation using triboelectric nanogenerators. Since their emergence in 2012, triboelectric nanogenerators have experienced fast development both in fundamental science aspects and technological innovations resulting in a plethora of outstanding applications and commercial opportunities in e.g. micro-nano energy systems, self-powered sensors, blue energy, and high-voltage power sources.The Handbook of Triboelectric Nanogenerators provides an indispensable overview of the state of the art in the field. It begins with a review of the physical and technological fundamentals and provides detailed coverage of triboelectric nanogenerators for cutting-edge applications from wearable electronics and medical implants to smart home sensing devices and human–machine interfacing.Edited and authored by active researchers in the field, the handbook offers a wealth of information for applied physicists and chemists, as well as materials scientists and engineers. In addition, mechanical and electronic engineers working in the fields of energy scavenging, power sources, and sensor-related application development will benefit greatly from the technical information presented in this groundbreaking reference work.

This Handbook serves as an authoritative reference book in the field of Neuroengineering. Neuroengineering is a very exciting field that is rapidly getting established as core subject matter for research and education. The Neuroengineering field has also produced an impressive array of industry products and clinical applications. It also serves as a reference book for graduate students, research scholars and teachers. Selected sections or a compendium of chapters may be used as “reference book” for a one or two semester graduate course in Biomedical Engineering. Some academicians will construct a “textbook” out of selected sections or chapters. The Handbook is also meant as a state-of-the-art volume for researchers. Due to its comprehensive coverage, researchers in one field covered by a certain section of the Handbook would find other sections valuable sources of cross-reference for information and fertilization of interdisciplinary ideas. Industry researchers as well as clinicians using neurotechnologies will find the Handbook a single source for foundation and state-of-the-art applications in the field of Neuroengineering. Regulatory agencies, entrepreneurs, investors and legal experts can use the Handbook as a reference for their professional work as well.​

With tremendous improvement in computational power and availability of rich data, almost all engineering disciplines use data science at some level. This textbook presents material on data science comprehensively, and in a structured manner. It provides conceptual understanding of the fields of data science, machine learning, and artificial intelligence, with enough level of mathematical details necessary for the readers. This will help readers understand major thematic ideas in data science, machine learning and artificial intelligence, and implement first-level data science solutions to practical engineering problems. The book- Provides a systematic approach for understanding data science techniques Explain why machine learning techniques are able to cross-cut several disciplines. Covers topics including statistics, linear algebra and optimization from a data science perspective. Provides multiple examples to explain the underlying ideas in machine learning algorithms Describes several contemporary machine learning algorithms The textbook is primarily written for undergraduate and senior undergraduate students in different engineering disciplines including chemical engineering, mechanical engineering, electrical engineering, electronics and communications engineering for courses on data science, machine learning and artificial intelligence.

Get ready to be at the forefront of the future of urban development!As cities continue to rapidly grow, the demand for sustainable and efficient infrastructure becomes more urgent. That's where What Every Engineer Should Know About Smart Cities comes in, offering a comprehensive guide to the concepts and technologies driving the transformation of our cities.Delve into the world of smart cities and discover how information and communication technologies are revolutionizing urban environments. With clear definitions and a focus on real-world applications, this book explores the benefits and challenges of smart cities. It also highlights interdisciplinary topics such as smart buildings, autonomous cars, and urban emergency management systems.This book is not just a theoretical exploration of smart cities. It goes beyond that by providing an in-depth look at the key technologies that are essential to creating smart cities. From the Internet of Things and blockchain to digital twins and modeling and simulations, readers will gain a solid understanding of the foundational technologies that make smart cities possible. With detailed discussions and real-world examples of smart mobility, smart health, smart education, and smart agribusiness, readers will gain a deep understanding of the requirements and characteristics that engineers need to contribute to the development of smart cities.Whether you're an engineer looking to expand your knowledge, a city planner seeking to understand the latest trends, or simply someone interested in the future of urban living, What Every Engineer Should Know About Smart Cities is the ultimate guide to unlocking the potential of smart cities for sustainable urban development and improved quality of life.

This book presents selected, peer-reviewed proceedings of the 3rd International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022), held in the city of Can Tho, Vietnam, from 10 to 13 November 2022. The purpose of the conference is to explore and ensure an understanding of the critical aspects contributing to sustainable development with a focus on advanced mechanical engineering, automation, materials, machines and methods. The contributions published in this book come from authors representing universities, research institutes and industrial companies and reflect the results of a very broad spectrum of research, from micro- and nanoscale materials design and processing, to mechanical engineering technology in industry. Many of the contributions selected for these proceedings focus on materials modeling, eco-material processes and mechanical manufacturing.Volume 1 of this book focuses on topics dedicated to advanced materials and manufacturing technologies, ranging from synthesis of new materials to sustainable development manufacturing technology.

Exa-scale computing needs to re-examine the existing hardware platform that can support intensive data-oriented computing. Since the main bottleneck is from memory, we aim to develop an energy-efficient in-memory computing platform in this book. First, the models of spin-transfer torque magnetic tunnel junction and racetrack memory are presented. Next, we show that the spintronics could be a candidate for future data-oriented computing for storage, logic, and interconnect. As a result, by utilizing spintronics, in-memory-based computing has been applied for data encryption and machine learning. The implementations of in-memory AES, Simon cipher, as well as interconnect are explained in details. In addition, in-memory-based machine learning and face recognition are also illustrated in this book.

This reference text discusses conduction mechanism, structure construction, operation, performance evaluation and applications of nanoscale semiconductor materials and devices in VLSI circuits design.The text explains nano materials, devices, analysis of its design parameters to meet the sub-nano-regime challenges for CMOS devices. It discusses important topics including memory design and testing, fin field-effect transistor (FinFET), tunnel field-effect transistor (TFET) for sensors design, carbon nanotube field-effect transistor (CNTFET) for memory design, nanowire and nanoribbons, nano devices based low-power-circuit design, and microelectromechanical systems (MEMS) design.The book discusses nanoscale semiconductor materials, device models, and circuit design covers nanoscale semiconductor device structures and modeling discusses novel nano-semiconductor devices such as FinFET, CNTFET, and Nanowire covers power dissipation and reduction techniques Discussing innovative nanoscale semiconductor device structures and modeling, this text will be useful for graduate students, and academic researchers in diverse areas such as electrical engineering, electronics and communication engineering, nanoscience, and nanotechnology. It covers nano devices based low-power-circuit design, nanoscale devices based digital VLSI circuits, and novel devices based analog VLSI circuits design.

Exa-scale computing needs to re-examine the existing hardware platform that can support intensive data-oriented computing. Since the main bottleneck is from memory, we aim to develop an energy-efficient in-memory computing platform in this book. First, the models of spin-transfer torque magnetic tunnel junction and racetrack memory are presented. Next, we show that the spintronics could be a candidate for future data-oriented computing for storage, logic, and interconnect. As a result, by utilizing spintronics, in-memory-based computing has been applied for data encryption and machine learning. The implementations of in-memory AES, Simon cipher, as well as interconnect are explained in details. In addition, in-memory-based machine learning and face recognition are also illustrated in this book.

This book presents the select proceedings of 2nd International Congress on Advances in Mechanical and Systems Engineering (CAMSE 2021). It focuses on the recent advances in mechanical and systems engineering and their growing demands for increase in several design and development activities. The contents in this book cover a blend of mechanical engineering, computer-aided engineering, control engineering, and systems engineering to design and manufacture useful products. Various additional topics covered include mechanics, machines, materials science, thermo-fluids, and control with state-of-the-art computational methods to analyse, innovate, design, implement and operate complex systems which are economic, reliable, efficient and sustainable. Given the contents, this book will be useful for researchers and professionals working in the field of mechanical engineering and allied fields.

This book offers a collection of original peer-reviewed contributions presented at the 9th International Congress on Design and Modeling of Mechanical Systems (CMSM'2021), held on December 20-22, 2021, in Hammamet, Tunisia. It reports on research findings, advanced methods and industrial applications relating to mechanical systems, materials and structures, and machining. It covers vibration analysis, CFD modeling and simulation, intelligent monitoring and control, including applications related to industry 4.0 and additive manufacturing. Continuing on the tradition of the previous editions, and with a good balance of theory and practice, the book offers a timely snapshot, and a useful resource for both researchers and professionals in the field of design and modeling of mechanical systems.

This book presents selected, peer-reviewed proceedings of the International Conference on Advanced Mechanical Engineering, Automation and Sustainable Development 2021 (AMAS2021), held in the city of Ha Long, Vietnam, from November 4 to 7, 2021. AMAS2021 is a special meeting of the International Conference on Material, Machines and Methods for Sustainable Development (MMMS), with a strong focus on automation and fostering an overall approach to assist policy makers, industries, and researchers at various levels to position local technological development toward sustainable development. The contributions published in this book stem from a wide spectrum of research, ranging from micro- and nanomaterial design and processing, to special applications in mechanical technology, environmental protection, green development, and climate change mitigation. A large group of contributions selected for these proceedings also focus on modeling and manufacturing of ecomaterials.

Semiconductor Memories and Systems provides a comprehensive overview of the current state of semiconductor memory at the technology and system levels. After an introduction on market trends and memory applications, the book focuses on mainstream technologies, illustrating their current status, challenges and opportunities, with special attention paid to scalability paths. Technologies discussed include static random access memory (SRAM), dynamic random access memory (DRAM), non-volatile memory (NVM), and NAND flash memory. Embedded memory and requirements and system level needs for storage class memory are also addressed. Each chapter covers physical operating mechanisms, fabrication technologies, and the main challenges to scalability.Finally, the work reviews the emerging trends for storage class memory, mainly focusing on the advantages and opportunities of phase change based memory technologies. Features contributions from experts from leading companies in semiconductor memory Discusses physical operating mechanisms, fabrication technologies and paths to scalability for current and emerging semiconductor memories Reviews primary memory technologies, including SRAM, DRAM, NVM and NAND flash memory Includes emerging storage class memory technologies such as phase change memory

This book presents a detailed description of the most common nondestructive testing(NDT) techniques used for the testing and evaluation fiber-reinforced composite structures, during manufacturing and/or in service stages. In order to facilitate the understanding and the utility of the different NDT techniques presented, the book first provides some information regarding the defects and material degradation mechanisms observed in fiber-reinforced composite structures as well as their general description and most probable causes. It is written based on the extensive scientific research and engineering backgrounds of the authors in the NDT and structural health monitoring (SHM) of structural systems from various areas including electrical, mechanical, materials, civil and biomedical engineering. Pursuing a rigorous approach, the book establishes a fundamental framework for the NDT of fiber-reinforced composite structures, while emphasizing on the importance of technique's spatial resolution, integrated systems analysis and the significance of the influence stemming from the applicability of the NDT and the physical parameters of the test structures in the selection and utilization of adequate NDT techniques.The book is intended for students who are interested in the NDT of fiber-reinforced composite structures, researchers investigating the applicability of different NDT techniques to the inspections of structural systems, and NDT researchers and engineers working on the optimization of NDT systems for specific applications involving the use of fiber-reinforced composite structures.

This book gathers the proceedings of the 4th International Conference on Mechanical Engineering and Applied Composite Materials (MEACM), held in Beijing, China on October 24-25, 2020. The conference brought together researchers from several countries and covered all major areas of mechanical engineering and applied composite materials, new applications and current trends. The topics covered include: structure and design, mechanical manufacturing and automation, robotics and mechatronics, mechanical behavior of nanomaterials, nanocomposites, and composite mechanics. Given its scope, the book offers a source of information and inspiration for researchers seeking to improve their work and gather new ideas for future developments.

Additive Manufacturing and 3D Printing Technology: Principles and Applications consists of the construction and working details of all modern additive manufacturing and 3D-printing technology processes and machines, while also including the fundamentals, for a well-rounded educational experience. The book is written to help the reader understand the fundamentals of the systems. This book provides a selection of additive manufacturing techniques suitable for near-term application with enough technical background to understand the domain, its applicability, and to consider variations to suit technical and organizational constraints. It highlights new innovative 3D-printing systems, presents a view of 4D printing, and promotes a vision of additive manufacturing and applications toward modern manufacturing engineering practices. With the block diagrams, self-explanatory figures, chapter exercises, and photographs of lab-developed prototypes, along with case studies, this new textbook will be useful to students studying courses in Mechanical, Production, Design, Mechatronics, and Electrical Engineering.

Hybrid Energy Systems: Strategy for Industrial Decarbonization demonstrates how hybrid energy and processes can decarbonize energy industry needs for power and heating and cooling. It describes the role of hybrid energy and processes in nine major industry sectors and discusses how hybrid energy can offer sustainable solutions in each. Introduces the basics and examples of hybrid energy systems Examines hybrid energy and processes in coal, oil and gas, nuclear, building, vehicle, manufacturing and industrial processes, computing and portable electronic, district heating and cooling, and water sectors Shows that hybrid processes can improve efficiency and that hybrid energy can effectively insert renewable fuels in the energy industry Serves as a companion text to the author's book Hybrid Power: Generation, Storage, and Grids Written for advanced students, researchers, and industry professionals involved in energy-related processes and plants, this book offers latest research and practical strategies for application of the innovative field of hybrid energy.

This is the last of three volumes of the extensively revised and updated second edition of the Handbook of Superconductivity. The past twenty years have seen rapid progress in superconducting materials, which exhibit one of the most remarkable physical states of matter ever to be discovered. Superconductivity brings quantum mechanics to the scale of the everyday world. Viable applications of superconductors rely fundamentally on an understanding of these intriguing phenomena and the availability of a range of materials with bespoke properties to meet practical needs.While the first volume covers fundamentals and various classes of materials, the second addresses processing of these into various shapes and configurations needed for applications, and ends with chapters on refrigeration methods necessary to attain the superconducting state and the desired performance. This third volume starts with a wide range of methods permitting one to characterize both the materials and various end products of processing. Subsequently, diverse classes of both large scale and electronic applications are described. Volume 3 ends with a glossary relevant to all three volumes. Key Features: Covers the depth and breadth of the field Includes contributions from leading academics and industry professionals across the world Provides hands-on familiarity with the characterization methods and offers descriptions of representative examples of practical applications A comprehensive reference, the handbook is suitable for both graduate students and practitioners in experimental physics, materials science, and multiple engineering disciplines, including electronic and electrical, chemical, mechanical, metallurgy and others.

This book provides a cutting-edge research overview on the latest developments in the field of Optics and Photonics. All chapters are authored by the pioneers in their field and will cover the developments in Quantum Photonics, Optical properties of 2D Materials, Optical Sensors, Organic Opto-electronics, Nanophotonics, Metamaterials, Plasmonics, Quantum Cascade lasers, LEDs, Biophotonics and biomedical photonics and spectroscopy.

This edited volume covers technological developments and current research trends in the field of photonics, plasmonics and optics, focusing on photonic crystals, semiconductor optical devices, optical communications and optical sensors, with an emphasis on practical sectors. It broadly contains the latest research domains contributed by experts and researchers in their respective fields with a major focus on the basic physics. Works in the area of electromagnetic bandgap structures (EBG) and metasurfaces are included for applications in different aspects of communications systems. Further, it covers research phenomena of microwave photonic devices to develop miniaturized high-frequency devices.FEATURES Reviews nonlinear optical phenomena related with materials and crystals and plasmonic effects on device fabrications Contains a detailed analysis on photonic crystals with their applications in making all-optical passive components Focusses on nonlinear optics, more precisely on crystals and materials, and computational aspects on evaluating their properties from Maxwell's equations Presents an extensive study on the physics of EBG structures for application in antenna and high-frequency communications Includes metamaterials and metasurfaces for applications in photonics as well as in microwave engineering for high-frequency communication systems Photonics, Plasmonics and Information Optics: Research and Technological Advances is aimed at researchers, professionals and graduate students in optical communication, silicon photonics, photonic crystals, semiconductor optical devices, metamaterials and metasurfaces, and microwave photonics.

This book comprises the select proceedings of the International Conference on Emerging Trends in Traditional and Technical Textiles (ICETT 2019), and examines the latest developments and automation in the field of textile technology. The topics covered include geotextiles, filters, medical textiles, functional finishing of textiles, composites, sustainable textile materials, and pollution in the textile industry. The book also discusses various aspects of traditional textiles including traditional methods of designing textiles, traditional textiles as a new avatar for technical textiles, traditional and technical assets of Indian and Asian culture: phulkari, bagh, kalamkari and chope embroideries. This book can be useful for students, researchers, and professionals working in traditional textile design and technical textile applications.

Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

This book discusses various applications of machine learning using a new approach, the dynamic wavelet fingerprint technique, to identify features for machine learning and pattern classification in time-domain signals. Whether for medical imaging or structural health monitoring, it develops analysis techniques and measurement technologies for the quantitative characterization of materials, tissues and structures by non-invasive means. Intelligent Feature Selection for Machine Learning using the Dynamic Wavelet Fingerprint begins by providing background information on machine learning and the wavelet fingerprint technique. It then progresses through six technical chapters, applying the methods discussed to particular real-world problems. Theses chapters are presented in such a way that they can be read on their own, depending on the reader's area of interest, or read together to provide a comprehensive overview of the topic. Given its scope, the book will be of interest to practitioners, engineers and researchers seeking to leverage the latest advances in machine learning in order to develop solutions to practical problems in structural health monitoring, medical imaging, autonomous vehicles, wireless technology, and historical conservation.