551. A Parallel Computational Environment for Modeling the Resin Transfer Molding Process.
- Author
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Henz, Brian J., Shires, Dale R., Mohan, Ram V., Ghosh, S., Castro, J.C., and Lee, J.K.
- Subjects
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FINITE element method , *MANUFACTURING processes , *RESIDUAL stresses , *DEFORMATIONS (Mechanics) , *OBJECT-oriented programming , *PARALLEL processing , *MATERIALS science - Abstract
A parallel computational environment for modeling the resin transfer molding manufacturing process has been developed at the U.S. Army Research Laboratory. This environment utilizes an implicit numerical method for modeling resin flow, a thermal model for analyzing convection and conduction, and a resin kinetics model to compute the heat generated and degree of resin cure during the curing process. The computing environment also includes a multiscale thermal residual stress model for computing the distortions and residual stresses in the composite component caused by the manufacturing process. All of these models have been tied together within a parallel object-oriented programming framework. This paper will discuss the computing environment in detail and its utility to real world applications. © 2004 American Institute of Physics [ABSTRACT FROM AUTHOR]
- Published
- 2004
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