1. Full-Chip Multiple TSV-to-TSV Coupling Extraction and Optimization in 3D ICs.
- Author
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Taigon Song, Chang Liu, Yarui Peng, and Sung Kyu Li
- Subjects
THROUGH-silicon via ,INTEGRATED circuit design ,COUPLING agents (Chemistry) ,CHIP disposal in metal cutting ,SIGNALLING protocols (Telecommunication) - Abstract
TSV-to-TSV coupling is a new parasitic element in 3D ICs and can become a significant source of signal integrity problem. Existing studies on its extraction, however, becomes highly inaccurate when handling more than two TSVs on full-chip scale. In this paper we investigate the multiple TSV-to-TSV coupling issue and propose an accurate model that can be efficiently used for full-chip extraction. Unlike the common belief that only the closest neighboring TSVs affect the victim, our study shows that non-neighboring aggressors also cause non-negligible impact. Based on this observation, we propose an effective method of reducing the overall coupling level in multiple TSV cases. [ABSTRACT FROM AUTHOR]
- Published
- 2013